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Technical Specifications
Onsemi MC74HCU04DR2 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 8.75(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AB |
| Logic Family | HC |
| Logic Function | Inverter |
| Process Technology | CMOS |
| Number of Elements per Chip | 6 |
| Maximum High Level Output Current | -5.2mA |
| Maximum Low Level Output Current | 5.2mA |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | 5V1P1 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Onsemi MC74HCU04DR2 Datasheet
Download the complete datasheet for Onsemi MC74HCU04DR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.