This 14-pin SOIC N NAND gate IC is manufactured by Onsemi and features a CMOS process technology. It has a lead-frame SMT package type and a small outline IC narrow body package description. The IC has a maximum package length of 8.75mm, a maximum package width of 4mm, and a maximum package height of 1.5mm. It is designed for surface mount applications and has a seated plane height of 1.75mm. The IC operates within a temperature range of -40 to 85°C.
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Onsemi MC74LCX00D technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC N |
| Package Description | Small Outline IC Narrow Body |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 8.75(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AB |
| Logic Family | LCX |
| Logic Function | NAND |
| Process Technology | CMOS |
| Number of Elements per Chip | 4 |
| Number of Element Inputs | 2-IN |
| Number of Element Outputs | 1 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 5V1P1 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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