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Technical Specifications
Onsemi MM74HC148N technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
16
PCB
16
Package Length (mm)
19.69(Max)
Package Width (mm)
7.11(Max)
Package Height (mm)
4.95(Max)
Seated Plane Height (mm)
5.33(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Jedec
MS-001BB
Logic Family
HC
Type
Priority
Number of Element Inputs
8
Number of Element Outputs
3
Clock Controlling Signal
No
Process Technology
CMOS
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
5V1P1
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi MM74HC148N Datasheet
Download the complete datasheet for Onsemi MM74HC148N to view detailed technical specifications.
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