CMOS D-Type Bus Interface Flip-Flop, positive-edge triggered, non-inverting. Features one element with 8 inputs and 8 outputs. Housed in a 20-pin SOIC W (SOP) wide body package with gull-wing leads for surface mounting. Operates across a temperature range of -40°C to 85°C.
PackageSOIC W
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Onsemi MM74HC273WMX technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC W |
| Package Description | Small Outline IC Wide Body |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 12.8 |
| Package Width (mm) | 7.5 |
| Package Height (mm) | 2.34(Max) |
| Seated Plane Height (mm) | 2.49 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Package Orientation | Yes |
| Package Orientation Marking Type | Dot |
| Jedec | MS-013 |
| Logic Family | HC |
| Logic Function | D-Type Bus Interface |
| Process Technology | CMOS |
| Number of Elements per Chip | 1 |
| Number of Element Inputs | 8 |
| Number of Element Outputs | 8 |
| Polarity | Non-Inverting |
| Triggering Type | Positive-Edge |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Onsemi MM74HC273WMX Datasheet
Download the complete datasheet for Onsemi MM74HC273WMX to view detailed technical specifications.
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