PackageSOIC W
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Onsemi MM74HCT245WM technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC W
Package Description
Small Outline IC Wide Body
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
12.95(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.4(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Logic Family
HCT
Logic Function
Bus Transceiver
Data Flow Direction
Bi-Directional
Number of Elements per Chip
1
Polarity
Non-Inverting
Process Technology
CMOS
Output Type
3-State
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
5V1P1
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi MM74HCT245WM Datasheet
Download the complete datasheet for Onsemi MM74HCT245WM to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.