PackageQFN EP
MountingSurface Mount
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Technical Specifications
Onsemi NB7V33MMNG technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
QFN EP
Package Description
Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
16
PCB
16
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
0.87
Seated Plane Height (mm)
0.9
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Type
Divider Buffer
Number of Outputs per Chip
1
Output Logic Level
CML
Input Logic Level
CML|LVDS|LVPECL
Maximum Input Frequency
11000(Typ)MHz
Min Operating Supply Voltage
1.71V
Max Operating Supply Voltage
2.625V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
5V1P1
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi NB7V33MMNG Datasheet
Download the complete datasheet for Onsemi NB7V33MMNG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.