The NCP1013AP133G is a power management IC in a PDIP package, designed for flyback topology applications. It operates over a temperature range of -40°C to 150°C and is compliant with RoHS standards. The device has a maximum power dissipation of 19W and a maximum output current of 350mA. The IC is available in a package quantity of 1000 units, packaged in a rail/tube format. It is suitable for use in through-hole mounting applications.
PackagePDIP
MountingThrough Hole
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Technical Specifications
Onsemi NCP1013AP133G technical specifications.
General
| Package/Case | PDIP |
| Duty Cycle | 72% |
| Halogen Free | Halogen Free |
| Height | 3.44mm |
| Lead Free | Lead Free |
| Length | 10.16mm |
| Max Duty Cycle | 72% |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -40°C |
| Max Output Current | 350mA |
| Max Power Dissipation | 19W |
| Max Supply Voltage | 10V |
| Mount | Through Hole |
| Package Quantity | 1000 |
| Packaging | Rail/Tube |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Switching Frequency-Max | 143kHz |
| Topology | Flyback |
| Width | 6.6mm |
Compliance
| RoHS | Compliant |
Datasheet
Onsemi NCP1013AP133G Datasheet
Download the complete datasheet for Onsemi NCP1013AP133G to view detailed technical specifications.
No datasheet is available for this part.
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