The NCP1397DR2G is a 16-pin SOIC lead-frame SMT power management IC with a small outline IC narrow body package. It has a maximum package length of 10mm, width of 4mm, and height of 1.5mm, with a seated plane height of 1.75mm and a pin pitch of 1.27mm. The IC is designed for surface mount applications and is made of plastic. It conforms to the Jedec MS-012AC standard.
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Onsemi NCP1397DR2G technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC N |
| Package Description | Small Outline IC Narrow Body |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 10(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AC |
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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