PackageSOIC W
MountingSurface Mount
Quick Jump:
Technical Specifications
Onsemi NCV7708BDWR2G technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC W
Package Description
Small Outline IC Wide Body
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
18.05(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.36(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-013AE
Type
Motor Driver
Min Operating Supply Voltage
3V
Max Operating Supply Voltage
5.5V
Maximum Operating Current
4mA
Min Operating Temperature
-40°C
Max Operating Temperature
150°C
Compliance
Cage Code
5V1P1
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
PPAP
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi NCV7708BDWR2G Datasheet
Download the complete datasheet for Onsemi NCV7708BDWR2G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.