PackageMicro
MountingSurface Mount
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Technical Specifications
Onsemi NLSX3012DMR2G technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
Micro
Package Description
Micro Package
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-187AA
Logic Function
Voltage Level Translator
Output Type
3-State|Open Drain
Maximum Low Level Output Current
0.02mA
Maximum High Level Output Current
-0.02mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
5V1P1
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi NLSX3012DMR2G Datasheet
Download the complete datasheet for Onsemi NLSX3012DMR2G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.