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| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP W |
| Package Description | Thin Shrink Small Outline Package Wide |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 6.6(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AC |
| Logic Function | Voltage Level Translator |
| Output Type | 3-State|Open Drain |
| Maximum Low Level Output Current | 0.02mA |
| Maximum High Level Output Current | -0.02mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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