PackageTSSOP W
MountingSurface Mount
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Technical Specifications
Onsemi NLSX3018DTR2G technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP W
Package Description
Thin Shrink Small Outline Package Wide
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
6.6(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AC
Logic Function
Voltage Level Translator
Output Type
3-State|Open Drain
Maximum Low Level Output Current
0.02mA
Maximum High Level Output Current
-0.02mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
5V1P1
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi NLSX3018DTR2G Datasheet
Download the complete datasheet for Onsemi NLSX3018DTR2G to view detailed technical specifications.
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