This device is an asymmetric dual N-channel power MOSFET that integrates 30 V and 25 V FETs in a compact 5 x 6 mm footprint. It uses Power Trench and Power Clip construction to reduce conduction and driver losses in fast-switching designs. The part is intended for system voltage rails and general-purpose point-of-load applications. Maximum continuous drain current is specified up to 180 A for Q1 and 130 A for Q2 in steady-state conditions, with a maximum gate-source voltage of ±16 V. Junction-to-case thermal resistance is specified as 4.3 °C/W for Q1 and 3.3 °C/W for Q2.
Sign in to ask questions about the Onsemi NTMFD0D9N02P1E datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Onsemi NTMFD0D9N02P1E technical specifications.
| Channel Type | Dual N-Channel |
| Configuration | Asymmetric |
| Drain-Source Voltage (Q1) | 30V |
| Drain-Source Voltage (Q2) | 25V |
| Gate-Source Voltage | ±16V |
| Continuous Drain Current (Q1) | 180A |
| Continuous Drain Current (Q2) | 130A |
| Thermal Resistance Junction-to-Case (Q1) | 4.3°C/W |
| Thermal Resistance Junction-to-Case (Q2) | 3.3°C/W |
| Thermal Resistance Junction-to-Ambient (Q1) | 130°C/W |
| Thermal Resistance Junction-to-Ambient (Q2) | 120°C/W |
| Footprint | 5 x 6mm |
| Technology | Power Trench |
| Clip Type | Power Clip |
Download the complete datasheet for Onsemi NTMFD0D9N02P1E to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.