8-channel non-inverting 3-state buffer/line driver, utilizing LS logic family and bipolar process technology. Features 8 inputs and 8 outputs, with 2 elements per chip. Surface mountable in a 20-pin SOIC W wide body package (JEDEC MS-013AC) with gull-wing leads and a 1.27mm pin pitch. Operating temperature range from 0°C to 70°C.
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Onsemi SN74LS244DWR2 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC W |
| Package Description | Small Outline IC Wide Body |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 12.95(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.4(Max) |
| Seated Plane Height (mm) | 2.65(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-013AC |
| Logic Family | LS |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 2 |
| Number of Inputs per Chip | 8 |
| Number of Outputs per Chip | 8 |
| Process Technology | Bipolar |
| Polarity | Non-Inverting |
| Output Type | 3-State |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Cage Code | 5V1P1 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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