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NXP FXOS8700CQ technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | QFN |
| Package Description | Quad Flat No Lead Package |
| Lead Shape | No Lead |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 3 |
| Package Width (mm) | 3 |
| Package Height (mm) | 1.2(Max) |
| Seated Plane Height (mm) | 1.25(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | Accelerometer and Magnetometer |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | H1R01 |
| EU RoHS | Yes with Exemption |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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