The TNY376DG is a flyback IC from Power Integrations with a maximum power dissipation of 19W and a duty cycle of 65%. It is available in a SOIC-8 package and is designed for surface mount applications. The IC features fault protection against over voltage and over temperature conditions. It operates within a temperature range of -40°C to 150°C. The TNY376DG is not RoHS compliant and is not radiation hardened.
PackageSOIC
MountingSurface Mount
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Technical Specifications
Power Integrations TNY376DG technical specifications.
General
| Package/Case | SOIC |
| Duty Cycle | 65% |
| Fault Protection | Over Voltage, Over Temperature |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 19W |
| Mount | Surface Mount |
| Package Quantity | 100 |
| Packaging | Rail/Tube |
| Radiation Hardening | No |
| RoHS Compliant | No |
| Series | TinySwitch®-PK |
| Topology | Flyback |
Compliance
| RoHS | Not CompliantNo |
Datasheet
Power Integrations TNY376DG Datasheet
Download the complete datasheet for Power Integrations TNY376DG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.