Search Results for "Brand University of Applied Sciences Mechanical Manufacturing Degree{官网:ｂｚｗ９８５.ｃｏｍ}四川Université d"

Obsolete

IP-R-UNIV-CORE

Brady

UNIVERSAL RIBBON CORE; Accessory Type:Printer Ribbon; For Use With:Brady IP Thermal Transfer Printer; Product Range:- ;RoHS Compliant: NA

Volume Production

Lead Free: Lead Free

DS9100-C/NO-BRAND

iButton Accessories

Obsolete

Series: DS9100

DS9092-3/NO-BRAND

iButton Accessories

Obsolete

Series: DS9092

DS9101/NO-BRAND

iButton Accessories

Obsolete

Series: DS9101

DS9096P/NO-BRAND

iButton Accessories

Obsolete

Series: DS9096P

DS9092L/NO-BRAND

iButton Accessories

Obsolete

Series: DS9092L

DS9093N/NO-BRAND

iButton Accessories

Obsolete

Series: DS9093

DS9093F/NO-BRAND

iButton Accessories

Obsolete

Series: DS9093F

DS9075-40V/NO-BRAND

SOCKET ADAPTER SIP TO 40DIP

Obsolete

Lead Free: Contains Lead

Number of Positions: 40

Packaging: Bulk

Series: DS9075

DS9093SNO-BRAND

iButton Accessories

Obsolete

Series: DS9093S

DS9093A-50/NO-BRAND

iButton Accessories

Obsolete

Series: DS9093A

DS9093RB/NO-BRAND

iButton Accessories

Obsolete

Series: DS9093RB

DS9093RA/NO-BRAND

iButton Accessories

Obsolete

Series: DS9093RA

S1125-APPLICATOR

TE Connectivity(Raychem)

TE CONNECTIVITY / RAYCHEM S1125-APPLICATOR APPLICATOR, S1125 ADHESIVE

Volume Production

Mount: Adhesive

Reach SVHC Compliant: Unknown

EPX-PLUS-II-APPLICATOR

3M EPX-PLUS-II-APPLICATOR MANUAL APPLICATOR SCOTCH-W

Volume Production

Package/Case: Epoxy

Color: Grey

Mount: Adhesive

Package Quantity: 10

TWR-MECH

NXP

MCF52259, MMA8451Q, MPR121 ColdFire® Series Robotics Evaluation Board

Volume Production

Package/Case: Module

Core Architecture: Coldfire

Evaluation Kit: Yes

Reach SVHC Compliant: No

MD8832-d1Gb-MECH

Sandisk

Flash Memory, Disk On Chip

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

+10

COMP-1

Daniels Manufacturing QM/TNM Series, Crimp Tool Positioner

Volume Production

Series: QM/TNM

COMP-2

Daniels Manufacturing HD, HDD Series, Crimp Tool Positioner

Volume Production

Series: HD, HDD

Search Results for "Brand University of Applied Sciences Mechanical Manufacturing Degree{官网:ｂｚｗ９８５.ｃｏｍ}四川Université d"

Filters

UP2-DEVKIT/UNIV

Intel(Altera)

KIT DEVELOPMENT UNIVERSITY UP2

Obsolete

IP-R-UNIV-CORE

Brady

UNIVERSAL RIBBON CORE; Accessory Type:Printer Ribbon; For Use With:Brady IP Thermal Transfer Printer; Product Range:- ;RoHS Compliant: NA

Volume Production

Lead Free: Lead Free

DS9100-C/NO-BRAND

iButton Accessories

Obsolete

Series: DS9100

DS9092-3/NO-BRAND

iButton Accessories

Obsolete

Series: DS9092

DS9101/NO-BRAND

iButton Accessories

Obsolete

Series: DS9101

DS9096P/NO-BRAND

iButton Accessories

Obsolete

Series: DS9096P

DS9092L/NO-BRAND

iButton Accessories

Obsolete

Series: DS9092L

DS9093N/NO-BRAND

iButton Accessories

Obsolete

Series: DS9093

DS9093F/NO-BRAND

iButton Accessories

Obsolete

Series: DS9093F

DS9075-40V/NO-BRAND

SOCKET ADAPTER SIP TO 40DIP

Obsolete

Lead Free: Contains Lead

Number of Positions: 40

Packaging: Bulk

Series: DS9075

DS9093SNO-BRAND

iButton Accessories

Obsolete

Series: DS9093S

DS9093A-50/NO-BRAND

iButton Accessories

Obsolete

Series: DS9093A

DS9093RB/NO-BRAND

iButton Accessories

Obsolete

Series: DS9093RB

DS9093RA/NO-BRAND

iButton Accessories

Obsolete

Series: DS9093RA

S1125-APPLICATOR

TE Connectivity(Raychem)

TE CONNECTIVITY / RAYCHEM S1125-APPLICATOR APPLICATOR, S1125 ADHESIVE

Volume Production

Mount: Adhesive

Reach SVHC Compliant: Unknown

EPX-PLUS-II-APPLICATOR

3M EPX-PLUS-II-APPLICATOR MANUAL APPLICATOR SCOTCH-W

Volume Production

Package/Case: Epoxy

Color: Grey

Mount: Adhesive

Package Quantity: 10

TWR-MECH

NXP

MCF52259, MMA8451Q, MPR121 ColdFire® Series Robotics Evaluation Board

Volume Production

Package/Case: Module

Core Architecture: Coldfire

Evaluation Kit: Yes

Reach SVHC Compliant: No

MD8832-d1Gb-MECH

Sandisk

Flash Memory, Disk On Chip

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

+10

COMP-1

Daniels Manufacturing QM/TNM Series, Crimp Tool Positioner

Volume Production

Series: QM/TNM

COMP-2

Daniels Manufacturing HD, HDD Series, Crimp Tool Positioner