Search Results for &quot; ADSP-CM408CSWZ-BF &quot;

32-bit 600MHz DSP, Blackfin, 132KB, BGA, SM

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Core Architecture: Blackfin

Data Bus Width: 32b

Density: 132KB

+28

ADSP-BF525KBCZ-5

Low Power Blackfin Processor with Advanced Peripherals

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Core Architecture: Blackfin

Data Bus Width: 16b

+19

ADSP-BF525ABCZ-6

Low Power Blackfin Processor with Advanced Peripherals

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Core Architecture: Blackfin

Data Bus Width: 16b

Frequency: 600MHz

ADSP-BF523KBCZ-6

IC DSP 16BIT 600MHZ 289-CSBGA

Volume Production

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Core Architecture: Blackfin

Data Bus Width: 16b

ADSP-BF536BBC-4A

Blackfin Processor with Embedded Network Connectivity

MO-205AE, CSPBGA-182

Obsolete

Package/Case: BGA

Core Architecture: Blackfin

Data Bus Width: 16b

Frequency: 400MHz

ADSP-BF534BBC-5A

Blackfin Processor with CAN Connectivity for Automotive & Industrial Applications

MO-205AE, CSPBGA-182

Obsolete

Package/Case: BGA

Contact Plating: Tin, Silver, Lead

Core Architecture: Blackfin

Data Bus Width: 16b

ADSP-BF534BBC-4A

Blackfin Processor with CAN Connectivity for Automotive & Industrial Applications

MO-205AE, CSPBGA-182

Obsolete

Package/Case: BGA

Contact Plating: Tin, Silver, Lead

Core Architecture: Blackfin

Data Bus Width: 16b

ADSP-BF706KCPZ-4

Low Power 400MHz Blackfin+ Embedded Processor with 1MByte L2 SRAM

HVQCCN,

Active

Max Operating Temperature: 70

Number of Terminals: 88

Min Operating Temperature: 0

Terminal Position: QUAD

ADSP-BF706BCPZ-4

400MHz DSP, 1MB L2 SRAM, Industrial, 88-Pin XQCC

HVQCCN,

Active

Max Operating Temperature: 85

Number of Terminals: 88

Min Operating Temperature: -40

Terminal Position: QUAD

ADSP-BF608KBCZ-5

Blackfin Dual-Core Processor up to 1GHz with Hardware Support for VGA Video Analytics

LFBGA, BGA349,22X22,32

Active

Max Operating Temperature: 70

Number of Terminals: 349

Min Operating Temperature: 0

Terminal Position: BOTTOM

ADSP-BF592BCPZ-2

Low Cost Blackfin with Optimized Peripheral Set for Industrial and General Purpose Applications

HVQCCN, LCC64,.35SQ,20

Active

Max Operating Temperature: 85

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: QUAD

ADSP-BF703BBCZ-3

Low Power 400MHz Blackfin+ Embedded Processor with 256KByte L2 SRAM & DDR2/LPDDR Interface

LFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 184

Min Operating Temperature: -40

Terminal Position: BOTTOM

ADSP-BF516BBCZ-3

DSP 16/32-bit Fixed-Point 300MHz 168-Pin CSP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: CSP-BGA

Package Description: Chip Scale Ball Grid Array Package

+33

ADSP-BF518BSWZ-4

DSP 16/32-bit Fixed-Point 400MHz 176-Pin LQFP EP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP EP

Package Description: Low Profile Quad Flat Package, Exposed Pad

+33

ADSP-BF514KSWZ-4

DSP 16/32-bit Fixed-Point 400MHz 176-Pin LQFP EP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP EP

Package Description: Low Profile Quad Flat Package, Exposed Pad

+33

ADSP-BF516KBCZ-4

Low Power Blackfin with Advanced Embedded Connectivity

LFBGA, BGA168,14X14,32

Active

Package/Case: BGA

Core Architecture: Blackfin

Data Bus Width: 16b

Frequency: 400MHz

ADSP-BF536BBC-3A

Blackfin Processor with Embedded Network Connectivity

MO-205AE, CSPBGA-182

Obsolete

Package/Case: BGA

Core Architecture: Blackfin

Data Bus Width: 16b

Frequency: 400MHz

+17

ADSP-BF526KBCZ-4

Low Power Blackfin Processor with Advanced Peripherals and Low Standby Power

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Core Architecture: Blackfin

Data Bus Width: 16b

+17

ADSP-BF522KBCZ-4

Low Power Blackfin Processor with Advanced Peripherals and Low Standby Power

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Core Architecture: Blackfin

Data Bus Width: 16b

+17

ADSP-BF700KCPZ-1

Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM

HVQCCN,

Active

Max Operating Temperature: 70

Number of Terminals: 88

Min Operating Temperature: 0

Terminal Position: QUAD