Search Results for &quot; CSM5500CD90-V5510-1B &quot;

Metal-Oxide Varistors

Not Recommended for New Design

Package/Case: Radial

Energy: 450J

Max Operating Temperature: 85°C

Min Operating Temperature: -55°C

V550LT80CPX2855

Metal-Oxide Varistors

Not Recommended for New Design

Package/Case: Radial

Energy: 450J

Max Operating Temperature: 85°C

Min Operating Temperature: -55°C

V550LC80CPX2855

Metal-Oxide Varistors

Not Recommended for New Design

Package/Case: Radial

Energy: 450J

Max Operating Temperature: 85°C

Min Operating Temperature: -55°C

V550LA80CPX2855

Metal-Oxide Varistors

Active

Package/Case: Radial

Energy: 450J

Max Operating Temperature: 85°C

Min Operating Temperature: -55°C

V55C2256164VBUK8

256Mbit Mobile SDRAM 16Mx16 2.5V 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLC8

256Mb Mobile SDRAM 16Mx16 125MHz 2.5V 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLE7

256Mb Mobile SDRAM 16Mx16 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUF7

256Mbit Mobile SDRAM 16Mx16 2.5V 60-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

+21

V55C2256164VBUZ8

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

Die

Active

Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit

V55C2256164VBLP8

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

Die

Active

Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit

V55C2256164VBLN8

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

Die

Active

Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit

V55C2256164VBUP8

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

Die

Active

Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit

V55C2256164VBUG8

256Mbit Mobile SDRAM 16Mx16 2.5V 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLF8

256Mb Mobile SDRAM 16Mx16 2.5V 60-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

+21

V55C2256164VBLS7

256Mb Mobile SDRAM 16Mx16 2.5V 60-Pin FBGA IC

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

+21

V55C2256164VBUM8

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: BGA

Package Description: Plastic Ball Grid Array

+19

V55C2256164VBUH8

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: BGA

Package Description: Plastic Ball Grid Array

+19

V55C2256164VBLN7

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

Die

Active

Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit

V55C2256164VBUD8

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

Die

Active

Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit

V55C2256164VBLD8

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

Die

Active

Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit