Search Results for &quot; LPC11U36FBD48401, &quot;

32-Bit RISC MCU, 50MHz, 28-Pin TSSOP, Industrial, FLASH, ADC

4.40 MM HEIGHT, PLASTIC, SOT361-1, MO-153, TSSOP-28

Active

Max Operating Temperature: 85

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

LPC1113FHN33/302

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller

7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33

Active

Package/Case: SOT-865-3

Frequency: 50MHz

Max Operating Temperature: 85°C

Max Supply Voltage: 3.6V

LPC1111FHN33/102

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller

HVQCCN,

Active

Package/Case: SOT-865-3

Frequency: 50MHz

Max Operating Temperature: 85°C

Memory Size: 8KB

LPC1113FHN33/302:5

IC MCU 32BIT 24KB FLASH 32HVQFN

Volume Production

Core Architecture: ARM

Interface: I2C, SPI, UART, USART

Lead Free: Lead Free

Packaging: Tape and Reel

LPC1111FHN33/201

32-bit ARM Cortex M0 MCU, 8KB Flash, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1114FHI33/302,5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1112FHI33/102,5

32-bit ARM Cortex M0 MCU, 16KB Flash, 3.3V, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1112FHI33/203,5

32-bit ARM Cortex M0 MCU, 50MHz, 16KB Flash, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1114FHN33/301,5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 32-Pin HVQFN

Surface Mount

Active

Package/Case: HVQFN EP

Pin Count: 32

PCB: 32

Package Length (mm): 7

LPC1114FHN33/303

32-Bit RISC MCU, 50MHz, FLASH, 33-Pin, Industrial, 1.8-3.6V

7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33

Active

Max Operating Temperature: 85

Number of Terminals: 33

Min Operating Temperature: -40

Terminal Position: QUAD

LPC1112FHI33/203

32-Bit RISC MCU, 50MHz, Flash, 33-Pin, Industrial

HVQCCN,

Active

Max Operating Temperature: 85

Number of Terminals: 33

Min Operating Temperature: -40

Terminal Position: QUAD

LPC1112FHN33/202:5

IC MCU 32BIT 16K FLASH 32HVQFN

Volume Production

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

Lead Free: Lead Free

+14

LPC1111FHN33/202

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller

HVQCCN,

Active

Package/Case: SOT-865-3

Frequency: 50MHz

Max Operating Temperature: 85°C

Memory Size: 8KB

LPC1114FHI33/303

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller

HVQCCN,

Active

Package/Case: SOT-617-3

Number of ADC Channels: 8

Number of Bits: 32

Number of GPIO: 28

LPC1114FHN33/201

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 4KB RAM, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1111FHN33/101

32-bit ARM Cortex M0 MCU, 50MHz, 8KB Flash, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1112FHN33/101

32-bit ARM Cortex M0 MCU, 16KB Flash, 3.3V, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1114FHN33/301

32-bit ARM Cortex M0 MCU, 32KB Flash, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1113FHN33/203,5

32-bit ARM Cortex M0 MCU, 50MHz, 24KB Flash, 32-Pin HVQFN

Surface Mount

Active

Package/Case: HVQFN EP

Pin Count: 32

PCB: 32

Package Length (mm): 7

LPC1111FHN33/102,5

32-bit ARM MCU 50MHz 8KB FLASH 33HVQFN

Volume Production

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Height: 1mm

+30

Search Results for "LPC11U36FBD48401,"

Filters

LPC1114FDH28/102

32-Bit RISC MCU, 50MHz, 28-Pin TSSOP, Industrial, FLASH, ADC

4.40 MM HEIGHT, PLASTIC, SOT361-1, MO-153, TSSOP-28

Active

Max Operating Temperature: 85

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

LPC1113FHN33/302

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller

7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33

Active

Package/Case: SOT-865-3

Frequency: 50MHz

Max Operating Temperature: 85°C

Max Supply Voltage: 3.6V

LPC1111FHN33/102

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller

HVQCCN,

Active

Package/Case: SOT-865-3

Frequency: 50MHz

Max Operating Temperature: 85°C

Memory Size: 8KB

LPC1113FHN33/302:5

IC MCU 32BIT 24KB FLASH 32HVQFN

Volume Production

Core Architecture: ARM

Interface: I2C, SPI, UART, USART

Lead Free: Lead Free

Packaging: Tape and Reel

LPC1111FHN33/201

32-bit ARM Cortex M0 MCU, 8KB Flash, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1114FHI33/302,5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1112FHI33/102,5

32-bit ARM Cortex M0 MCU, 16KB Flash, 3.3V, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1112FHI33/203,5

32-bit ARM Cortex M0 MCU, 50MHz, 16KB Flash, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1114FHN33/301,5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 32-Pin HVQFN

Surface Mount

Active

Package/Case: HVQFN EP

Pin Count: 32

PCB: 32

Package Length (mm): 7

LPC1114FHN33/303

32-Bit RISC MCU, 50MHz, FLASH, 33-Pin, Industrial, 1.8-3.6V

7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33

Active

Max Operating Temperature: 85

Number of Terminals: 33

Min Operating Temperature: -40

Terminal Position: QUAD

LPC1112FHI33/203

32-Bit RISC MCU, 50MHz, Flash, 33-Pin, Industrial

HVQCCN,

Active

Max Operating Temperature: 85

Number of Terminals: 33

Min Operating Temperature: -40

Terminal Position: QUAD

LPC1112FHN33/202:5

IC MCU 32BIT 16K FLASH 32HVQFN

Volume Production

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

Lead Free: Lead Free

+14

LPC1111FHN33/202

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller

HVQCCN,

Active

Package/Case: SOT-865-3

Frequency: 50MHz

Max Operating Temperature: 85°C

Memory Size: 8KB

LPC1114FHI33/303

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller

HVQCCN,

Active

Package/Case: SOT-617-3

Number of ADC Channels: 8

Number of Bits: 32

Number of GPIO: 28

LPC1114FHN33/201

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 4KB RAM, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1111FHN33/101

32-bit ARM Cortex M0 MCU, 50MHz, 8KB Flash, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1112FHN33/101

32-bit ARM Cortex M0 MCU, 16KB Flash, 3.3V, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1114FHN33/301

32-bit ARM Cortex M0 MCU, 32KB Flash, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1113FHN33/203,5

32-bit ARM Cortex M0 MCU, 50MHz, 24KB Flash, 32-Pin HVQFN

Surface Mount

Active

Package/Case: HVQFN EP

Pin Count: 32

PCB: 32

Package Length (mm): 7

LPC1111FHN33/102,5

32-bit ARM MCU 50MHz 8KB FLASH 33HVQFN