Search Results for &quot; M24M01-RMW6TG &quot;

2-Kbit serial I2C bus EEPROM

0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -20

Terminal Position: DUAL

+14

M24C02-RDS6TG

IC EEPROM 2K I2C 400KHZ 8MSOP

Obsolete

Access Time: 900ns

Package/Case: MSOP

Frequency: 400kHz

Interface: I2C

M24C08-FMN6TP

8 Kbit serial I2C bus EEPROM

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C08-FMC6TG

8 Kbit serial I2C bus EEPROM

HVSON,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C04-FMN6TP

4 Kbit serial I2C bus EEPROM

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C16-RDS6TG

2KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3 X 3 MM, ROHS COMPLIANT, TSSOP-8

TSSOP, TSSOP8,.19

Obsolete

Access Time: 900ns

Package/Case: MSOP

Frequency: 400kHz

Interface: I2C

M24C64-FMH6TG

64Kbit Serial I2C EEPROM, Industrial, 1.7-5.5V

VBCC,

Active

Max Operating Temperature: 85

Number of Terminals: 5

Min Operating Temperature: -40

Terminal Position: BOTTOM

+12

M24SR64-YMC6T/2

64-Kbit NFC/RFID Tag IC, I2C, Industrial, 8-Pin PDSO

UFDFP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+11

M24C64-WMN6TP

64Kb I2C EEPROM, SOIC, 5.5V, 400kHz

SOP-8

Not Recommended

Access Time: 900ns

Access Time-Max: 450ns

Package/Case: SOIC

Density: 64Kb

+27

M24C32-XDW5TG

32Kbit I2C EEPROM, 4Kx8, 1.8-5V, 8-Pin TSSOP, SMT

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24512-DFDW6G

512Kbit Serial-I2C EEPROM, 64Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24128-DFMN6P

128Kbit I2C EEPROM, 16Kx8, 1.8-5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M24128-DFMN6G

128Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M24128-DFCS6P/K

128Kbit EEPROM, Serial-I2C, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BFMC6P

128Kbit I2C EEPROM, 1MHz, 1.8-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-DFMC6G

128Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24C32-XMC5TP

32Kbit I2C EEPROM, 8-Pin UFDFPN, 1.8-5V, 1MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24C04-FMB5TG

EEPROM Serial-I2C 4K-bit 8-Pin UFDFPN EP SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRCS6P/K

256Kbit Serial-I2C EEPROM, 32Kx8, 1.8-5.5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24C02-WDW6TP

2Kb I2C EEPROM, 400kHz, TSSOP, 2.5-5.5V

0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8

Not Recommended

Access Time: 900ns

Access Time-Max: 900ns

Package/Case: TSSOP

Density: 2Kb

Search Results for "M24M01-RMW6TG"

Filters

M24C02-FDW6TP

2-Kbit serial I2C bus EEPROM

0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -20

Terminal Position: DUAL

+14

M24C02-RDS6TG

IC EEPROM 2K I2C 400KHZ 8MSOP

Obsolete

Access Time: 900ns

Package/Case: MSOP

Frequency: 400kHz

Interface: I2C

M24C08-FMN6TP

8 Kbit serial I2C bus EEPROM

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C08-FMC6TG

8 Kbit serial I2C bus EEPROM

HVSON,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C04-FMN6TP

4 Kbit serial I2C bus EEPROM

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C16-RDS6TG

2KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3 X 3 MM, ROHS COMPLIANT, TSSOP-8

TSSOP, TSSOP8,.19

Obsolete

Access Time: 900ns

Package/Case: MSOP

Frequency: 400kHz

Interface: I2C

M24C64-FMH6TG

64Kbit Serial I2C EEPROM, Industrial, 1.7-5.5V

VBCC,

Active

Max Operating Temperature: 85

Number of Terminals: 5

Min Operating Temperature: -40

Terminal Position: BOTTOM

+12

M24SR64-YMC6T/2

64-Kbit NFC/RFID Tag IC, I2C, Industrial, 8-Pin PDSO

UFDFP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+11

M24C64-WMN6TP

64Kb I2C EEPROM, SOIC, 5.5V, 400kHz

SOP-8

Not Recommended

Access Time: 900ns

Access Time-Max: 450ns

Package/Case: SOIC

Density: 64Kb

+27

M24C32-XDW5TG

32Kbit I2C EEPROM, 4Kx8, 1.8-5V, 8-Pin TSSOP, SMT

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24512-DFDW6G

512Kbit Serial-I2C EEPROM, 64Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24128-DFMN6P

128Kbit I2C EEPROM, 16Kx8, 1.8-5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M24128-DFMN6G

128Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M24128-DFCS6P/K

128Kbit EEPROM, Serial-I2C, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BFMC6P

128Kbit I2C EEPROM, 1MHz, 1.8-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-DFMC6G

128Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24C32-XMC5TP

32Kbit I2C EEPROM, 8-Pin UFDFPN, 1.8-5V, 1MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24C04-FMB5TG

EEPROM Serial-I2C 4K-bit 8-Pin UFDFPN EP SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRCS6P/K

256Kbit Serial-I2C EEPROM, 32Kx8, 1.8-5.5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24C02-WDW6TP

2Kb I2C EEPROM, 400kHz, TSSOP, 2.5-5.5V

0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8

Not Recommended

Access Time: 900ns

Access Time-Max: 900ns

Package/Case: TSSOP

Density: 2Kb