Search Results for &quot; M95040-DFMN6TP &quot;

8KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

0.150 INCH, PLASTIC, SOP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95320-WMN6

4KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

0.150 INCH, PLASTIC, SOP-8

Active

Access Time: 60ns

Access Time-Max: 40ns

Package/Case: SO

Height: 1.25mm

+14

M95128-RMN5

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -20

Terminal Position: DUAL

M95128-WDW4G/K

128Kbit Serial-SPI EEPROM, 8-Pin TSSOP, 3.3V/5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-RDW3G/K

128Kbit Serial-SPI EEPROM, 8-Pin TSSOP, 2.5-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95320-WMN6P

32Kb SPI EEPROM, 10MHz, SOIC, 2.5-5.5V, SM

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Active

Access Time: 10ms

Access Time-Max: 40ns

Package/Case: SOIC

Density: 32Kb

M95128-RMC3G/K

128Kb Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-WCS6P/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, WLCSP, 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-RMC3P/K

128Kbit Serial-SPI EEPROM, 16Kx8, 2.5-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95640-WMN6T

8KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

0.150 INCH, PLASTIC, SOP-8

Active

Access Time: 10ms

Access Time-Max: 40ns

Package/Case: SOIC

Density: 64Kb

+17

M95M01-RMW6G

1 Mbit SPI bus EEPROM with high-speed clock

SOP, SOP8,.3

Obsolete

Access Time: 80ns

Access Time-Max: 80ns

Package/Case: SOIC

Density: 1Mb

M95640-DW6TP

8KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.169 INCH, ROHS COMPLIANT, TSSOP-8

0.169 INCH, ROHS COMPLIANT, TSSOP-8

Transferred

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95640-WMN3P

8KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

SOP, SOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95160-RDW6T

2KX8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8

TSSOP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

AA1-B0-12-615-M95-MK

Carling Technologies

Circuit Breaker 1Pole 15A 277VAC/80VDC

Panel Mount

Active

Current Rating: 15A

Number of Poles: 1

Packaging: Bulk

Radiation Hardening: No

M95512-RMN6P

512Kb SPI EEPROM, 5MHz, SOIC, 1.8-5.5V

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Active

Access Time: 150ns

Access Time-Max: 80ns

Package/Case: SOIC

Density: 512Kb

M95128-RDW3P/K

128Kbit Serial-SPI EEPROM, 8-Pin TSSOP, 2.5-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-RMC6G

128Kbit Serial-SPI EEPROM, 16Kx8, 2.5-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95512-WMN6P

512Kb SPI EEPROM, 5MHz, SOIC, 5.5V

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Active

Access Time: 60ns

Access Time-Max: 40ns

Package/Case: SOIC

Density: 512Kb

M95128-RCS6P/K

128Kbit EEPROM Serial-SPI WLCSP 8-Pin 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

Search Results for "M95040-DFMN6TP"

Filters

M95640-WMN6

8KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

0.150 INCH, PLASTIC, SOP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95320-WMN6

4KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

0.150 INCH, PLASTIC, SOP-8

Active

Access Time: 60ns

Access Time-Max: 40ns

Package/Case: SO

Height: 1.25mm

+14

M95128-RMN5

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -20

Terminal Position: DUAL

M95128-WDW4G/K

128Kbit Serial-SPI EEPROM, 8-Pin TSSOP, 3.3V/5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-RDW3G/K

128Kbit Serial-SPI EEPROM, 8-Pin TSSOP, 2.5-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95320-WMN6P

32Kb SPI EEPROM, 10MHz, SOIC, 2.5-5.5V, SM

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Active

Access Time: 10ms

Access Time-Max: 40ns

Package/Case: SOIC

Density: 32Kb

M95128-RMC3G/K

128Kb Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-WCS6P/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, WLCSP, 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-RMC3P/K

128Kbit Serial-SPI EEPROM, 16Kx8, 2.5-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95640-WMN6T

8KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

0.150 INCH, PLASTIC, SOP-8

Active

Access Time: 10ms

Access Time-Max: 40ns

Package/Case: SOIC

Density: 64Kb

+17

M95M01-RMW6G

1 Mbit SPI bus EEPROM with high-speed clock

SOP, SOP8,.3

Obsolete

Access Time: 80ns

Access Time-Max: 80ns

Package/Case: SOIC

Density: 1Mb

M95640-DW6TP

8KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.169 INCH, ROHS COMPLIANT, TSSOP-8

0.169 INCH, ROHS COMPLIANT, TSSOP-8

Transferred

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95640-WMN3P

8KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

SOP, SOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95160-RDW6T

2KX8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8

TSSOP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

AA1-B0-12-615-M95-MK

Carling Technologies

Circuit Breaker 1Pole 15A 277VAC/80VDC

Panel Mount

Active

Current Rating: 15A

Number of Poles: 1

Packaging: Bulk

Radiation Hardening: No

M95512-RMN6P

512Kb SPI EEPROM, 5MHz, SOIC, 1.8-5.5V

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Active

Access Time: 150ns

Access Time-Max: 80ns

Package/Case: SOIC

Density: 512Kb

M95128-RDW3P/K

128Kbit Serial-SPI EEPROM, 8-Pin TSSOP, 2.5-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-RMC6G

128Kbit Serial-SPI EEPROM, 16Kx8, 2.5-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95512-WMN6P

512Kb SPI EEPROM, 5MHz, SOIC, 5.5V

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Active

Access Time: 60ns

Access Time-Max: 40ns

Package/Case: SOIC

Density: 512Kb

M95128-RCS6P/K

128Kbit EEPROM Serial-SPI WLCSP 8-Pin 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package