Search Results for &quot; M95160-WDW6TP &quot;

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -20

Terminal Position: DUAL

M95128-WMN6

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

SOP, SOP8,.25

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95128-RDW3G/K

128Kbit Serial-SPI EEPROM, 8-Pin TSSOP, 2.5-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-RMC3G/K

128Kb Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-WCS6P/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, WLCSP, 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-RMC3P/K

128Kbit Serial-SPI EEPROM, 16Kx8, 2.5-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-RDW3P/K

128Kbit Serial-SPI EEPROM, 8-Pin TSSOP, 2.5-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-RCS6P/K

128Kbit EEPROM Serial-SPI WLCSP 8-Pin 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-RMC6P

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-RMC6G

128Kbit Serial-SPI EEPROM, 16Kx8, 2.5-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-RDW6P

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.169 INCH, ROHS COMPLIANT, TSSOP-8

0.169 INCH, ROHS COMPLIANT, TSSOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95128-RMN5T

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -20

Terminal Position: DUAL

M95128-RMN3P/K

128Kbit Serial-SPI EEPROM, 8-Pin SOIC, 2.5-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-RMN3G/K

128Kbit Serial-SPI EEPROM, 16Kx8, 2.5-5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-WCS6G/K

128Kb Serial-SPI EEPROM, 16Kx8, 3.3/5V, WLCSP, 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-WMN3T

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95128-RMN6T

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95128-WMN6G

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

SOP, SOP8,.25

Not Recommended

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95128-WMN6T

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Access Time: 150ns

Package/Case: SO

Frequency: 20MHz

Interface: SPI

+12

M95128-WMN4P/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

Search Results for "M95160-WDW6TP"

Filters

M95128-RMN5

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -20

Terminal Position: DUAL

M95128-WMN6

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

SOP, SOP8,.25

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95128-RDW3G/K

128Kbit Serial-SPI EEPROM, 8-Pin TSSOP, 2.5-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-RMC3G/K

128Kb Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-WCS6P/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, WLCSP, 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-RMC3P/K

128Kbit Serial-SPI EEPROM, 16Kx8, 2.5-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-RDW3P/K

128Kbit Serial-SPI EEPROM, 8-Pin TSSOP, 2.5-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-RCS6P/K

128Kbit EEPROM Serial-SPI WLCSP 8-Pin 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-RMC6P

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-RMC6G

128Kbit Serial-SPI EEPROM, 16Kx8, 2.5-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-RDW6P

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.169 INCH, ROHS COMPLIANT, TSSOP-8

0.169 INCH, ROHS COMPLIANT, TSSOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95128-RMN5T

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -20

Terminal Position: DUAL

M95128-RMN3P/K

128Kbit Serial-SPI EEPROM, 8-Pin SOIC, 2.5-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-RMN3G/K

128Kbit Serial-SPI EEPROM, 16Kx8, 2.5-5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-WCS6G/K

128Kb Serial-SPI EEPROM, 16Kx8, 3.3/5V, WLCSP, 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-WMN3T

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95128-RMN6T

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95128-WMN6G

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

SOP, SOP8,.25

Not Recommended

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95128-WMN6T

16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Access Time: 150ns

Package/Case: SO

Frequency: 20MHz

Interface: SPI

+12

M95128-WMN4P/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body