Skip to main content

Browse Manufacturers API BOM

Browse Categories Browse Manufacturers Search Parts API Docs Updated Parts Terms & Conditions Privacy Policy

©2026 Datasheets.com

Browse Manufacturers API BOM

Browse Manufacturers API BOM

Search Results for "MCIMX27MJP4A"

Filters

SoC i.MX21 ARM926EJ-S 400MHz 473-Pin MAP-BGA 0.09um

Ball Grid Array

NRND

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MICROPROCESSOR

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473

Not Recommended

Max Operating Temperature: 85

Number of Terminals: 473

Min Operating Temperature: -40

Terminal Position: BOTTOM

Browse Manufacturers API BOM