PackageSOIC
Capacitance100pF
MountingSurface Mount
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Technical Specifications
Stmicroelectronics CLP30-200B1RL technical specifications.
General
| Capacitance | 100pF |
| Package/Case | SOIC |
| Contact Plating | Gold |
| Direction | Bidirectional |
| Lead Free | Lead Free |
| Mount | Surface Mount |
| Number of Channels | 1 |
| Number of Elements | 1 |
| Package Quantity | 2500 |
| Packaging | Tape and Reel |
| Peak Pulse Current | 30A |
| RoHS Compliant | Yes |
| Series | CLP |
| Termination | SMD/SMT |
Compliance
| RoHS | Compliant |
Datasheet
Stmicroelectronics CLP30-200B1RL Datasheet
Download the complete datasheet for Stmicroelectronics CLP30-200B1RL to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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