PackageDIP
MountingThrough Hole
Power200mW
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Technical Specifications
Stmicroelectronics HCF4532BEY technical specifications.
General
Package/Case
DIP
High Level Output Current
6.8mA
Independent Circuits
1
Low Level Output Current
6.8mA
Max Operating Temperature
125°C
Min Operating Temperature
-40°C
Max Supply Voltage
20V
Min Supply Voltage
3V
Mount
Through Hole
Number of Bits
8
Number of Gates
1
Number of Input Lines
1
Number of Output Lines
8
Number of Outputs
5
Package Quantity
25
Packaging
Rail/Tube
Power Dissipation
200mW
Propagation Delay
160ns
Radiation Hardening
No
RoHS Compliant
Yes
Series
4000B
Supply Type
Dual
Compliance
RoHS
Compliant
Datasheet
Stmicroelectronics HCF4532BEY Datasheet
Download the complete datasheet for Stmicroelectronics HCF4532BEY to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.