PackageDIP
MountingThrough Hole
Power200mW
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Technical Specifications
Stmicroelectronics HCF4532BEY technical specifications.
General
| Package/Case | DIP |
| High Level Output Current | 6.8mA |
| Independent Circuits | 1 |
| Low Level Output Current | 6.8mA |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 20V |
| Min Supply Voltage | 3V |
| Mount | Through Hole |
| Number of Bits | 8 |
| Number of Gates | 1 |
| Number of Input Lines | 1 |
| Number of Output Lines | 8 |
| Number of Outputs | 5 |
| Package Quantity | 25 |
| Packaging | Rail/Tube |
| Power Dissipation | 200mW |
| Propagation Delay | 160ns |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | 4000B |
| Supply Type | Dual |
Compliance
| RoHS | Compliant |
Datasheet
Stmicroelectronics HCF4532BEY Datasheet
Download the complete datasheet for Stmicroelectronics HCF4532BEY to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.