PackageLGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics LSM330 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
LGA
Package/Case
LGA
Package Description
Land Grid Array Package
Lead Shape
No Lead
Pin Count
24
PCB
24
Package Length (mm)
3.5
Package Width (mm)
3
Package Height (mm)
0.8
Seated Plane Height (mm)
1
Pin Pitch (mm)
0.43
Package Material
Plastic
Mounting
Surface Mount
Category
INEMO Inertial Module
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
SCR76
EU RoHS
Yes with Exemption
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics LSM330 Datasheet
Download the complete datasheet for Stmicroelectronics LSM330 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.