
256K-bit Serial I2C EEPROM memory, organized as 32K x 8, operates with a 1 MHz maximum frequency and 450 ns maximum access time. This surface-mount device features a Wafer Level Chip Scale Package (WLCSP) with 8 pins, a 0.8mm pin pitch, and dimensions of 1.27mm x 1.36mm x 0.35mm. It supports a wide operating voltage range from 1.7V to 5.5V, with typical supply voltages including 1.8V, 2.5V, 3.3V, and 5V. The component offers 200 years of data retention and includes hardware data protection.
Stmicroelectronics M24256-DFCS6P/K technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WLCSP |
| Package Description | Wafer Level Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 1.27 |
| Package Width (mm) | 1.36 |
| Package Height (mm) | 0.35 |
| Seated Plane Height (mm) | 0.54 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 256Kbit |
| Interface Type | Serial-I2C |
| Maximum Operating Frequency | 1MHz |
| Maximum Access Time | 450ns |
| Organization | 32Kx8 |
| Maximum Operating Current | 2.5mA |
| Typical Operating Supply Voltage | 1.8|2.5|3.3|5V |
| Density in Bits | 262144bit |
| Data Retention | 200(Min)Year |
| Hardware Data Protection | Yes |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Supply Voltage | 1.7V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | SCR76 |
| EU RoHS | Yes |
| HTS Code | 8542320051 |
| Schedule B | 8542320050 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Download the complete datasheet for Stmicroelectronics M24256-DFCS6P/K to view detailed technical specifications.
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