256K-bit Serial I2C EEPROM memory, organized as 32K x 8, operates with a 1 MHz maximum frequency and 450 ns maximum access time. This surface-mount device features a Wafer Level Chip Scale Package (WLCSP) with 8 pins, a 0.8mm pin pitch, and dimensions of 1.27mm x 1.36mm x 0.35mm. It supports a wide operating voltage range from 1.7V to 5.5V, with typical supply voltages including 1.8V, 2.5V, 3.3V, and 5V. The component offers 200 years of data retention and includes hardware data protection.
PackageWLCSP
MountingSurface Mount
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Technical Specifications
Stmicroelectronics M24256-DFCS6P/K technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLCSP
Package Description
Wafer Level Chip Scale Package
Lead Shape
Ball
Pin Count
8
PCB
8
Package Length (mm)
1.27
Package Width (mm)
1.36
Package Height (mm)
0.35
Seated Plane Height (mm)
0.54
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
256Kbit
Interface Type
Serial-I2C
Maximum Operating Frequency
1MHz
Maximum Access Time
450ns
Organization
32Kx8
Maximum Operating Current
2.5mA
Typical Operating Supply Voltage
1.8|2.5|3.3|5V
Density in Bits
262144bit
Data Retention
200(Min)Year
Hardware Data Protection
Yes
Max Operating Supply Voltage
5.5V
Min Operating Supply Voltage
1.7V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542320051
Schedule B
8542320050
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Stmicroelectronics M24256-DFCS6P/K Datasheet
Download the complete datasheet for Stmicroelectronics M24256-DFCS6P/K to view detailed technical specifications.
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