
256K-bit Serial I2C EEPROM memory, organized as 32K x 8, operates with a 1 MHz maximum frequency and a 450 ns maximum access time. This surface-mount component features a wafer-level chip-scale package (WLCSP) with 8 pins, a 0.8 mm pin pitch, and dimensions of 1.27 mm x 1.36 mm x 0.35 mm. It supports operating supply voltages of 2.5V, 3.3V, and 5V, with a minimum operating voltage of 1.8V and a maximum of 5.5V. The device offers 200 years of data retention and includes hardware data protection.
Stmicroelectronics M24256-DRCS6G/K technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WLCSP |
| Package Description | Wafer Level Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 1.27 |
| Package Width (mm) | 1.36 |
| Package Height (mm) | 0.35 |
| Seated Plane Height (mm) | 0.54 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 256Kbit |
| Interface Type | Serial-I2C |
| Maximum Operating Frequency | 1MHz |
| Maximum Access Time | 450ns |
| Organization | 32Kx8 |
| Maximum Operating Current | 2.5mA |
| Typical Operating Supply Voltage | 2.5|3.3|5V |
| Density in Bits | 262144bit |
| Data Retention | 200(Min)Year |
| Hardware Data Protection | Yes |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Supply Voltage | 1.8V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | SCR76 |
| EU RoHS | Yes |
| HTS Code | 8542320051 |
| Schedule B | 8542320050 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Download the complete datasheet for Stmicroelectronics M24256-DRCS6G/K to view detailed technical specifications.
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