Serial SPI EEPROM with 512K-bit density, organized as 64K x 8. Features a 5 MHz maximum operating frequency and 80 ns maximum access time. Supports 2.5V, 3.3V, and 5V operating supply voltages, with a range of 1.8V to 5.5V. Packaged in an 8-pin WLCSP (Wafer Level Chip Scale Package) with a Ball Grid Array (BGA) mounting style, measuring 1.94mm x 1.27mm x 0.35mm. Offers 200 years of data retention and hardware data protection, operating from -40°C to 85°C.
PackageWLCSP
MountingSurface Mount
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Technical Specifications
Stmicroelectronics M95512-DRCS6P/K technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLCSP
Package Description
Wafer Level Chip Scale Package
Lead Shape
Ball
Pin Count
8
PCB
8
Package Length (mm)
1.94
Package Width (mm)
1.27
Package Height (mm)
0.35
Seated Plane Height (mm)
0.54
Package Material
Plastic
Mounting
Surface Mount
Density
512Kbit
Interface Type
Serial-SPI
Maximum Operating Frequency
5MHz
Maximum Access Time
80ns
Organization
64Kx8
Maximum Operating Current
2.5mA
Typical Operating Supply Voltage
2.5|3.3|5V
Density in Bits
524288bit
Data Retention
200(Min)Year
Hardware Data Protection
Yes
Max Operating Supply Voltage
5.5V
Min Operating Supply Voltage
1.8V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Programming Voltage
1.8 to 5.5V
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542320051
Schedule B
8542320050
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics M95512-DRCS6P/K Datasheet
Download the complete datasheet for Stmicroelectronics M95512-DRCS6P/K to view detailed technical specifications.
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