48-Pin QFN EP System-On-Chip (SoC) featuring CMOS process technology and a microprocessor core. Operates at a maximum clock rate of 8 MHz, with a ROMLess program memory type. Designed for surface mount installation on PCBs, this component utilizes a Quad Flat No Lead package with an exposed pad, measuring 7mm x 7mm x 0.88mm with a 0.5mm pin pitch. Supports UART interface and operates within a supply voltage range of 13V to 18V, with an operating temperature range of -40°C to 85°C, suitable for Power Line Communication applications.
PackageQFN EP
MountingSurface Mount
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Technical Specifications
Stmicroelectronics ST7570 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
QFN EP
Package Description
Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
48
PCB
48
Package Length (mm)
7
Package Width (mm)
7
Package Height (mm)
0.88
Seated Plane Height (mm)
0.9
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220VKKD-2
Family Name
ST75xx
Maximum Clock Rate
8MHz
Program Memory Type
ROMLess
Maximum Speed
8MHz
Process Technology
CMOS
Type
System-On-Chip
Processing Unit
Microprocessor
Max Operating Supply Voltage
18V
Typical Operating Supply Voltage
13V
Application
Power line Communication
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Interface Type
UART
Programmability
No
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
5A992.c
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics ST7570 Datasheet
Download the complete datasheet for Stmicroelectronics ST7570 to view detailed technical specifications.
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