PackageFlip-Chip
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STCD2400F35F technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
Flip-Chip
Package/Case
Flip-Chip
Pin Count
12
PCB
12
Package Length (mm)
1.6
Package Width (mm)
1.6
Package Height (mm)
0.4
Seated Plane Height (mm)
0.61
Mounting
Surface Mount
Type
Fanout Buffer
Number of Outputs per Chip
4
Maximum Input Frequency
52MHz
Min Operating Supply Voltage
2.5V
Max Operating Supply Voltage
5.1V
Min Operating Temperature
-20°C
Max Operating Temperature
85°C
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics STCD2400F35F Datasheet
Download the complete datasheet for Stmicroelectronics STCD2400F35F to view detailed technical specifications.
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