PackagePBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI5105MYC technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
PBGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
23
Package Width (mm)
23
Package Height (mm)
1.82
Seated Plane Height (mm)
1.82
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
SCR76
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics STI5105MYC Datasheet
Download the complete datasheet for Stmicroelectronics STI5105MYC to view detailed technical specifications.
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