The STI5202DUC is a Ball Grid Array IC with a package length of 27mm and width of 27mm, made of plastic, and mounted via surface mount. It has 620 pins on the PCB and 620 pins in total. The IC is part of the BGA package family and has a fine pitch ball grid array package description.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI5202DUC technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 620 |
| PCB | 620 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | SCR76 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Stmicroelectronics STI5202DUC Datasheet
Download the complete datasheet for Stmicroelectronics STI5202DUC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.