The STI5211-1UC is a 572-pin Ball Grid Array System on Chip (SoC) from Stmicroelectronics. It features a plastic package with a ball lead shape and a surface mount configuration. The device is designed for surface mount applications and has a package length and width of 27mm. The package material is plastic and the basic package type is Ball Grid Array.
PackageBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI5211-1UC technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 572 |
| PCB | 572 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | SCR76 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Stmicroelectronics STI5211-1UC Datasheet
Download the complete datasheet for Stmicroelectronics STI5211-1UC to view detailed technical specifications.
No datasheet is available for this part.