PackageFBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI5267COUC technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
700
PCB
700
Package Length (mm)
27
Package Width (mm)
27
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
SCR76
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics STI5267COUC Datasheet
Download the complete datasheet for Stmicroelectronics STI5267COUC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.