The STI52891YA is a System on Chip (SoC) packaged in a 489-ball Ball Grid Array (BGA) with a plastic material and surface mount capabilities. It has a package length and width of 23mm and a pin pitch of 0.8mm. The device is designed for surface mount applications.
PackageBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI52891YA technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 489 |
| PCB | 489 |
| Package Length (mm) | 23 |
| Package Width (mm) | 23 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | SCR76 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Stmicroelectronics STI52891YA Datasheet
Download the complete datasheet for Stmicroelectronics STI52891YA to view detailed technical specifications.
No datasheet is available for this part.