The STI5514AWDL is a System on Chip (SoC) from Stmicroelectronics packaged in a 35mm x 35mm Ball Grid Array. It is designed for surface mount applications. The package material is plastic. The device has 388 pins on the PCB and 388 pins in total. It is a BGA package type with a plastic ball lead shape.
PackageBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI5514AWDL technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 388 |
| PCB | 388 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | SCR76 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Stmicroelectronics STI5514AWDL Datasheet
Download the complete datasheet for Stmicroelectronics STI5514AWDL to view detailed technical specifications.
No datasheet is available for this part.