The STI7100HWCGCPM is a System on Chip (SoC) packaged in a 680-pin Ball Grid Array (BGA). It is designed for surface mount applications and features a plastic package with a length and width of 35mm. The device has a pin count of 680 and is suitable for use in a variety of electronic systems.
PackageBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI7100HWCGCPM technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 680 |
| PCB | 680 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | SCR76 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Stmicroelectronics STI7100HWCGCPM Datasheet
Download the complete datasheet for Stmicroelectronics STI7100HWCGCPM to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.