The STI7109ZEBP is a System on Chip (SoC) packaged in a 35mm x 35mm Ball Grid Array. It features a plastic package material and surface mount mounting. The device has 680 pins on the PCB and 680 pins in total. The package is made of plastic and has a ball lead shape.
PackageBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI7109ZEBP technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 680 |
| PCB | 680 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | SCR76 |
| EU RoHS | No |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Stmicroelectronics STI7109ZEBP Datasheet
Download the complete datasheet for Stmicroelectronics STI7109ZEBP to view detailed technical specifications.
No datasheet is available for this part.