761-pin FBGA System-On-Chip (SoC) with ST40 device core, featuring a fine pitch ball grid array package for surface mounting. This microprocessor-based SoC includes 2 USB interfaces and 1 Ethernet interface supporting MII/RMII, designed for digital TV decoder applications. Programmable with Flash program memory, it utilizes a plastic package with ball leads.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STIH223ZKB technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
761
PCB
761
Package Material
Plastic
Mounting
Surface Mount
Device Core
ST40
Program Memory Type
Flash
Type
System-On-Chip
Processing Unit
Microprocessor
Application
Digital TV decoder
Interface Type
Ethernet/USB
SPI
0
I2C
0
I2S
0
UART
0
USB
2
USART
0
CAN
0
Ethernet
1
Programmability
Yes
Ethernet Interface Type
MII/RMII
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics STIH223ZKB Datasheet
Download the complete datasheet for Stmicroelectronics STIH223ZKB to view detailed technical specifications.
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