32-bit ARM Cortex M3 RISC microcontroller featuring 512KB Flash program memory and 64KB RAM. This surface-mount device operates at a maximum clock rate of 72 MHz and offers 51 programmable I/Os. Connectivity includes CAN, I2C, SPI, USART, and USB interfaces. The WLCSP package measures 4.47mm x 4.4mm with a 0.5mm pin pitch. Operating voltage ranges from 2.5V to 3.3V, with a temperature range of -40°C to 85°C.
PackageWLCSP
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STM32F103REY6 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLCSP
Package Description
Wafer Level Chip Scale Package
Lead Shape
Ball
Pin Count
64
PCB
64
Package Length (mm)
4.47
Package Width (mm)
4.4
Package Height (mm)
0.36
Seated Plane Height (mm)
0.59
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
STM32F
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
72MHz
Maximum CPU Frequency
72MHz
Device Core
ARM Cortex M3
Program Memory Type
Flash
Program Memory Size
512KB
RAM Size
64KB
Number of Programmable I/Os
51
Core Architecture
ARM
Programmability
Yes
Number of Timers
8
Interface Type
CAN/I2C/SPI/USART/USB
CAN
1
I2C
2
SPI
3
Ethernet
0
UART
0
USART
5
USB
1
I2S
0
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
16/16/16
Number of ADCs
Triple
DAC Channels
2/2
DAC Resolution
12/12bit
Number of DACs
Dual
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Stmicroelectronics STM32F103REY6 Datasheet
Download the complete datasheet for Stmicroelectronics STM32F103REY6 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.