32-bit ARM Cortex M3 RISC microcontroller featuring 512KB Flash program memory and 64KB RAM. This surface-mount device operates at up to 72 MHz with a 32-bit data bus width. It offers 80 programmable I/Os and includes multiple interfaces such as CAN, I2C, SPI, USART, and USB. The LFBGA package measures 10x10x1.09mm with a 0.8mm pin pitch, supporting a supply voltage range of 2.5V to 3.3V and operating temperatures from -40°C to 85°C.
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STM32F103VEH6TR technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LFBGA
Package Description
Low Profile Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
100
PCB
100
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
1.09
Seated Plane Height (mm)
1.7(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
STM32F
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
72MHz
Maximum CPU Frequency
72MHz
Device Core
ARM Cortex M3
Program Memory Type
Flash
Program Memory Size
512KB
RAM Size
64KB
Number of Programmable I/Os
80
Core Architecture
ARM
Programmability
Yes
Number of Timers
8
Interface Type
CAN/I2C/SPI/USART/USB
CAN
1
I2C
2
SPI
3
Ethernet
0
UART
0
USART
5
USB
1
I2S
0
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
16/16/16
Number of ADCs
Triple
DAC Channels
2/2
DAC Resolution
12/12bit
Number of DACs
Dual
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics STM32F103VEH6TR Datasheet
Download the complete datasheet for Stmicroelectronics STM32F103VEH6TR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.