The STM7710WUCP is a System on Chip (SoC) packaged in a 456-pin Ball Grid Array (BGA) with a plastic package material and a surface mount configuration. It has a package length of 27mm, width of 27mm, and a height of 2.44mm with a pin pitch of 1mm. The SoC is designed for use in a variety of applications and is manufactured by STmicroelectronics.
PackageBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STM7710WUCP technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 456 |
| PCB | 456 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 2.44 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | SCR76 |
| EU RoHS | No |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Stmicroelectronics STM7710WUCP Datasheet
Download the complete datasheet for Stmicroelectronics STM7710WUCP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.