PackageFlip-Chip
MountingSurface Mount
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Technical Specifications
Stmicroelectronics TS4855VIJT technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | Flip-Chip |
| Package/Case | Flip-Chip |
| Pin Count | 18 |
| PCB | 18 |
| Package Length (mm) | 2.4 |
| Package Width (mm) | 2.17 |
| Package Height (mm) | 0.35 |
| Pin Pitch (mm) | 0.5 |
| Mounting | Surface Mount |
Compliance
| Cage Code | SCR76 |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Stmicroelectronics TS4855VIJT Datasheet
Download the complete datasheet for Stmicroelectronics TS4855VIJT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.