PackageTSSOP
MountingSurface Mount
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Technical Specifications
Stmicroelectronics TSC103IYPT technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
3
Package Width (mm)
4.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AA
Type
Current Sense Amplifier
Number of Elements per Chip
1
Number of Channels per Chip
1
Maximum Input Offset Voltage
0.5@5VmV
Maximum Input Bias Current
0.015@5V@-40C to 125CuA
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
PPAP
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics TSC103IYPT Datasheet
Download the complete datasheet for Stmicroelectronics TSC103IYPT to view detailed technical specifications.
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