Capacitance1.5uF
MountingThrough Hole
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Technical Specifications
TDK B32562J1155K000 technical specifications.
General
| Capacitance | 1.5uF |
| Contact Plating | Tin, Matte |
| Depth | 4mm |
| Dielectric | PET |
| Lead Diameter | 0.6mm |
| Lead Pitch | 15mm |
| Length | 16.5mm |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -55°C |
| Mount | Through Hole |
| Packaging | Bulk |
| RoHS Compliant | Yes |
| Termination | Radial |
| Tolerance | 10% |
Compliance
| RoHS | Compliant |
Datasheet
TDK B32562J1155K000 Datasheet
Download the complete datasheet for TDK B32562J1155K000 to view detailed technical specifications.
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