PackageRadial
MountingThrough Hole
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Technical Specifications
TDK B57238S259M51 technical specifications.
General
| Package/Case | Radial |
| Contact Plating | Tin |
| Depth | 7mm |
| Lead Free | Lead Free |
| Max Operating Temperature | 170°C |
| Min Operating Temperature | -55°C |
| Mount | Through Hole |
| Packaging | Tape and Reel |
| Series | S238 |
| Thickness | 7mm |
| Tolerance | 20% |
Compliance
| RoHS | Compliant |
Datasheet
TDK B57238S259M51 Datasheet
Download the complete datasheet for TDK B57238S259M51 to view detailed technical specifications.
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