PackageRadial
MountingThrough Hole, PCB
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Technical Specifications
TDK B57238S509M51 technical specifications.
General
| Approvals | UL |
| Package/Case | Radial |
| Depth | 7mm |
| Diameter | 0.63inch |
| Lead Pitch | 0.295inch |
| Max Operating Temperature | 170°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 3.9W |
| Mount | Through Hole, PCB |
| Package Quantity | 1000 |
| Packaging | Tape and Reel |
| Resistance Tolerance | 20% |
| Series | S238 |
| Tolerance | 20% |
Compliance
| RoHS | Compliant |
Datasheet
TDK B57238S509M51 Datasheet
Download the complete datasheet for TDK B57238S509M51 to view detailed technical specifications.
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