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Technical Specifications
TDK CGA3E2X8R1H153K080AD technical specifications.
General
| Package/Case | QFN |
| Core Architecture | ARM |
| Interface | I2C, SPI, USB, IrDA, UART, USART |
| Max Operating Temperature | 85°C |
| Memory Size | 256KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 53 |
| Oscillator Type | Internal |
| Package Quantity | 1000 |
| Packaging | Cut Tape |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT, DMA, LCD |
| RoHS Compliant | Yes |
| Series | Leopard Gecko |
Compliance
| RoHS | Compliant |
Datasheet
TDK CGA3E2X8R1H153K080AD Datasheet
Download the complete datasheet for TDK CGA3E2X8R1H153K080AD to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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