MIC29302WU
Microchip
The purpose of this report is to qualify BCDM process Fab 2 to Fab 5 of MIC29302WU
Product Change NoticeMicrochip
Qualification Report for BCDM Process Migration to Fab 5 (MCSO) - MIC29302, MIC5821, MIC5822, MIC5014
Qualification report for Microchip's Fab 5 (MCSO) migration of BCDM technology devices including MIC29302WU, MIC5821YN, MIC5822YN, and MIC5014CYP in various packages.
Overview
This document outlines the qualification process for Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for multiple device families utilizing 20K (BCDM) technology. The report focuses on the MIC29302WU in a 5L-TO-263 package, which passed reliability testing including High Temperature Operating Life (HTOL) at 125°C for 1000 hours, ESD (HBM and CDM), Latch-up, HAST, Unbiased HAST, Temperature Cycling, and High Temperature Storage Life (HTSL). The MIC5821YN, MIC5822YN, and MIC5014CYP catalog part numbers in 16L PDIP and DICE packages are qualified by similarity (QBS) based on these results, complying with Microchip specification QCI-39000.
Use Cases
- Quality Assurance Verification
- Supply Chain Risk Management
- Vendor Migration Compliance
- Electronic Component Lifecycle Monitoring
- Production Readiness Assessment
Topics
Microchip
PCN
CENO-08KKRQ402
Fab 5
MCSO
MIC29302WU
MIC5821YN
MIC5822YN
MIC5014CYP
BCDM
5L-TO-263
16L PDIP
Referenced Parts
MIC29302WU
Microchip
Based on the reliability tests results, the MIC29302WU complies with the reliability guidelines
MIC29302WU
Microchip
The purpose of this report is to qualify BCDM process Fab 2 to Fab 5 of MIC29302WU, per Process
MIC5821YN
Microchip
for multiple device families available in various packages. The MIC5821YN, MIC5822YN and
MIC5821YN
Microchip
location for multiple device families available in various packages. The MIC5821YN,
MIC5822YN
Microchip
for multiple device families available in various packages. The MIC5821YN, MIC5822YN and
MIC5014CYP
Microchip
The MIC5821YN, MIC5822YN and MIC5014CYP catalog part numbers (CPN)
1.5X
Microchip
Pass 1.5X Vsupply
1000HRS
Microchip
HTOL 1000HRS at
1000HRS
Microchip
Test Method/Condition JESD22-A103, Ta = +150ºC, 1000HRS Minimum SS = 77
15/Lot
Microchip
ESD – HBM JS-001-2012 15/Lot 2 Pass +/- 500V
16L
Microchip
available in 16L PDIP (.300in) and DICE packages will qualify by similarity (QBS).
16L
Microchip
numbers (CPN) of 20K (BCDM) technology available in 16L PDIP
16L
Microchip
MIC5014CYP catalog part numbers (CPN) of 20K (BCDM) technology available in 16L PDIP
18/Lot
Microchip
ESD – CDM JS-002-2014 18/Lot 2 Pass +/- 2000V
2000V
Microchip
ESD – CDM JS-002-2014 18/Lot 2 Pass +/- 2000V
20K
Microchip
numbers (CPN) of 20K (BCDM) technology available in 16L PDIP
20K
Microchip
MIC5822YN and MIC5014CYP catalog part numbers (CPN) of 20K (BCDM) technology
20K
Microchip
MIC5014CYP catalog part numbers (CPN) of 20K (BCDM) technology available in 16L PDIP
500V
Microchip
ESD – HBM JS-001-2012 15/Lot 2 Pass +/- 500V
500cyc
Microchip
Lot # 500cyc ATE Results (Fail/SS) Result
5L-TO-263
Microchip
PACKAGE 5L-TO-263
6/Lot
Microchip
Latch-up JESD78 6/Lot 2, at +25◦C Pass +/-105mA I/O trigger,
96HR
Microchip
Lot # 96HR ATE Results (Fail/SS) Result
96HR
Microchip
Lot # 96HR Results (Fail/SS) Result
A5A0085
Microchip
20 A5A0085
A5A0086
Microchip
10 A5A0086
B5A0086
Microchip
0 B5A0086 TMPE221054307.100
CCB#7364.054
Microchip
Qual CCB#7364.054 and Package Qual CCB#7428.002. Following guidelines established in
CCB#7428.002.
Microchip
Qual CCB#7364.054 and Package Qual CCB#7428.002. Following guidelines established in
CENO-08KKRQ402
Microchip
PCN #: CENO-08KKRQ402
GTBF212900002.000
Microchip
ASSEMBLY LOT GTBF260500005.000 GTBF260500001.000 GTBF260600036.000 GTBF260600035.000 GTBF212900002.000
GTBF260500001.000
Microchip
ASSEMBLY LOT GTBF260500005.000 GTBF260500001.000 GTBF260600036.000 GTBF260600035.000 GTBF212900002.000
GTBF260500005.000
Microchip
ASSEMBLY LOT GTBF260500005.000 GTBF260500001.000 GTBF260600036.000 GTBF260600035.000 GTBF212900002.000
GTBF260600035.000
Microchip
ASSEMBLY LOT GTBF260500005.000 GTBF260500001.000 GTBF260600036.000 GTBF260600035.000 GTBF212900002.000
GTBF260600036.000
Microchip
ASSEMBLY LOT GTBF260500005.000 GTBF260500001.000 GTBF260600036.000 GTBF260600035.000 GTBF212900002.000
J-STD-020
Microchip
Test Method JEDEC J-STD-020 / JESD22-A113
JESD22-A103
Microchip
Test Method/Condition JESD22-A103, Ta = +150ºC, 1000HRS Minimum SS = 77
JESD22-A104
Microchip
Test Method/Condition JESD22-A104, Ta = -65 oC/+150 oC, 500 Cycles, Minimum SS =
JESD22-A108
Microchip
Test Method JESD22-A108 & MIL-STD 883 Method 1033
JESD22-A110
Microchip
Test Method/Condition JESD22-A110,
JESD22-A113
Microchip
Test Method JEDEC J-STD-020 / JESD22-A113
JESD22-A118
Microchip
Test Method/Condition JESD22-A118, Ta = +130 oC/85%RH, 96 HRS. Minimum SS = 77.
JESD78
Microchip
Latch-up JESD78 6/Lot 2, at +25◦C Pass +/-105mA I/O trigger,
JS-001-2012
Microchip
ESD – HBM JS-001-2012 15/Lot 2 Pass +/- 500V
JS-002-2014
Microchip
ESD – CDM JS-002-2014 18/Lot 2 Pass +/- 2000V
MCSO525416649.1
Microchip
WAFER LOT MCSO525416649.1
MIC5014CYP
Microchip
The MIC5821YN, MIC5822YN and MIC5014CYP catalog part
MIC5014CYP
Microchip
MIC5014CYP catalog part numbers (CPN) of 20K (BCDM) technology available in 16L PDIP
MIC5014CYP
Microchip
MIC5822YN and MIC5014CYP catalog part numbers (CPN) of 20K (BCDM) technology
MSL3
Microchip
Test Condition MSL3 (+30oC/60%RH) 192 Hours @ +260oC 3X Peak Reflow. Minimum SS = 231
TMPE221054307.100
Microchip
0 B5A0086 TMPE221054307.100
oC/+150
Microchip
Test Method/Condition JESD22-A104, Ta = -65 oC/+150 oC, 500 Cycles, Minimum SS =
| MIC29302WU | Microchip | The purpose of this report is to qualify BCDM process Fab 2 to Fab 5 of MIC29302WU |
| MIC5821YN | Microchip | The MIC5821YN, MIC5822YN and MIC5014CYP catalog part numbers (CPN) |
| MIC5822YN | Microchip | The MIC5821YN, MIC5822YN and MIC5014CYP catalog part numbers (CPN) |
| MIC29302WU | Microchip | Device MIC29302WU |
| MIC29302WU | Microchip | Based on the reliability tests results, the MIC29302WU complies with the reliability guidelines |
| MIC29302WU | Microchip | The purpose of this report is to qualify BCDM process Fab 2 to Fab 5 of MIC29302WU, per Process |
| MIC5821YN | Microchip | for multiple device families available in various packages. The MIC5821YN, MIC5822YN and |
| MIC5821YN | Microchip | location for multiple device families available in various packages. The MIC5821YN, |
| MIC5821YN | Microchip | The MIC5821YN, MIC5822YN and MIC5014CYP catalog part |
| MIC5822YN | Microchip | MIC5822YN and MIC5014CYP catalog part numbers (CPN) of 20K (BCDM) technology |
| MIC5822YN | Microchip | for multiple device families available in various packages. The MIC5821YN, MIC5822YN and |
| MIC5822YN | Microchip | The MIC5821YN, MIC5822YN and MIC5014CYP catalog part |
| MIC5014CYP | Microchip | The MIC5821YN, MIC5822YN and MIC5014CYP catalog part numbers (CPN) |
| 1.5X | Microchip | Pass 1.5X Vsupply |
| 1000HRS | Microchip | HTOL 1000HRS at |
| 1000HRS | Microchip | Test Method/Condition JESD22-A103, Ta = +150ºC, 1000HRS Minimum SS = 77 |
| 15/Lot | Microchip | ESD – HBM JS-001-2012 15/Lot 2 Pass +/- 500V |
| 16L | Microchip | available in 16L PDIP (.300in) and DICE packages will qualify by similarity (QBS). |
| 16L | Microchip | numbers (CPN) of 20K (BCDM) technology available in 16L PDIP |
| 16L | Microchip | MIC5014CYP catalog part numbers (CPN) of 20K (BCDM) technology available in 16L PDIP |
| 18/Lot | Microchip | ESD – CDM JS-002-2014 18/Lot 2 Pass +/- 2000V |
| 2000V | Microchip | ESD – CDM JS-002-2014 18/Lot 2 Pass +/- 2000V |
| 20K | Microchip | numbers (CPN) of 20K (BCDM) technology available in 16L PDIP |
| 20K | Microchip | MIC5822YN and MIC5014CYP catalog part numbers (CPN) of 20K (BCDM) technology |
| 20K | Microchip | MIC5014CYP catalog part numbers (CPN) of 20K (BCDM) technology available in 16L PDIP |
| 500V | Microchip | ESD – HBM JS-001-2012 15/Lot 2 Pass +/- 500V |
| 500cyc | Microchip | Lot # 500cyc ATE Results (Fail/SS) Result |
| 5L-TO-263 | Microchip | PACKAGE 5L-TO-263 |
| 6/Lot | Microchip | Latch-up JESD78 6/Lot 2, at +25◦C Pass +/-105mA I/O trigger, |
| 96HR | Microchip | Lot # 96HR ATE Results (Fail/SS) Result |
| 96HR | Microchip | Lot # 96HR Results (Fail/SS) Result |
| A5A0085 | Microchip | 20 A5A0085 |
| A5A0086 | Microchip | 10 A5A0086 |
| B5A0086 | Microchip | 0 B5A0086 TMPE221054307.100 |
| CCB#7364.054 | Microchip | Qual CCB#7364.054 and Package Qual CCB#7428.002. Following guidelines established in |
| CCB#7428.002. | Microchip | Qual CCB#7364.054 and Package Qual CCB#7428.002. Following guidelines established in |
| CENO-08KKRQ402 | Microchip | PCN #: CENO-08KKRQ402 |
| GTBF212900002.000 | Microchip | ASSEMBLY LOT GTBF260500005.000 GTBF260500001.000 GTBF260600036.000 GTBF260600035.000 GTBF212900002.000 |
| GTBF260500001.000 | Microchip | ASSEMBLY LOT GTBF260500005.000 GTBF260500001.000 GTBF260600036.000 GTBF260600035.000 GTBF212900002.000 |
| GTBF260500005.000 | Microchip | ASSEMBLY LOT GTBF260500005.000 GTBF260500001.000 GTBF260600036.000 GTBF260600035.000 GTBF212900002.000 |
| GTBF260600035.000 | Microchip | ASSEMBLY LOT GTBF260500005.000 GTBF260500001.000 GTBF260600036.000 GTBF260600035.000 GTBF212900002.000 |
| GTBF260600036.000 | Microchip | ASSEMBLY LOT GTBF260500005.000 GTBF260500001.000 GTBF260600036.000 GTBF260600035.000 GTBF212900002.000 |
| J-STD-020 | Microchip | Test Method JEDEC J-STD-020 / JESD22-A113 |
| JESD22-A103 | Microchip | Test Method/Condition JESD22-A103, Ta = +150ºC, 1000HRS Minimum SS = 77 |
| JESD22-A104 | Microchip | Test Method/Condition JESD22-A104, Ta = -65 oC/+150 oC, 500 Cycles, Minimum SS = |
| JESD22-A108 | Microchip | Test Method JESD22-A108 & MIL-STD 883 Method 1033 |
| JESD22-A110 | Microchip | Test Method/Condition JESD22-A110, |
| JESD22-A113 | Microchip | Test Method JEDEC J-STD-020 / JESD22-A113 |
| JESD22-A118 | Microchip | Test Method/Condition JESD22-A118, Ta = +130 oC/85%RH, 96 HRS. Minimum SS = 77. |
| JESD78 | Microchip | Latch-up JESD78 6/Lot 2, at +25◦C Pass +/-105mA I/O trigger, |
| JS-001-2012 | Microchip | ESD – HBM JS-001-2012 15/Lot 2 Pass +/- 500V |
| JS-002-2014 | Microchip | ESD – CDM JS-002-2014 18/Lot 2 Pass +/- 2000V |
| MCSO525416649.1 | Microchip | WAFER LOT MCSO525416649.1 |
| MIC5014CYP | Microchip | The MIC5821YN, MIC5822YN and MIC5014CYP catalog part |
| MIC5014CYP | Microchip | MIC5014CYP catalog part numbers (CPN) of 20K (BCDM) technology available in 16L PDIP |
| MIC5014CYP | Microchip | MIC5822YN and MIC5014CYP catalog part numbers (CPN) of 20K (BCDM) technology |
| MSL3 | Microchip | Test Condition MSL3 (+30oC/60%RH) 192 Hours @ +260oC 3X Peak Reflow. Minimum SS = 231 |
| TMPE221054307.100 | Microchip | 0 B5A0086 TMPE221054307.100 |
| oC/+150 | Microchip | Test Method/Condition JESD22-A104, Ta = -65 oC/+150 oC, 500 Cycles, Minimum SS = |